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| CMS11 TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type CMS11 Switching Mode Power Supply Applications Portable Equipment Battery Applications * * * * Forward voltage: VFM = 0.55 V (max) Average forward current: IF (AV) = 2.0 A Repetitive peak reverse voltage: VRRM = 40 V Suitable for compact assembly due to small surface-mount package "M-FLATTM" (Toshiba package name) Unit: mm Maximum Ratings (Ta = 25C) Characteristics Repetitive peak reverse voltage Symbol VRRM IF (AV) Average forward current Note IF (AV) Peak one cycle surge forward current (non-repetitive) Junction temperature Storage temperature IFSM Tj Tstg Rating 40 2.0 (Ta = 34C) 2.0 (T = 119C) 30 (50 Hz) -40~150 -40~150 A C C A Unit V JEDEC JEITA TOSHIBA 3-4E1A Note: Device mounted on a ceramic board (board size: 50 mm 50 mm, soldering land: 2 mm 2 mm) Weight: 0.023 g (typ.) 1 2003-02-17 CMS11 Electrical Characteristics (Ta = 25C) Characteristics Symbol VFM (1) Peak forward voltage VFM (2) VFM (3) Repetitive peak reverse current Junction capacitance IRRM Cj Test Condition IFM = 0.5 A IFM = 1.0 A IFM = 2.0 A VRRM = 5.0 V VRRM = 40 V VR = 10 V, f = 1.0 MHz Device mounted on a ceramic board (soldering land: 2 mm 2 mm) Thermal resistance Rth (j-a) Device mounted on a glass-epoxy board (soldering land: 6 mm 6 mm) 3/4 Min 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 Typ. 0.38 0.42 0.49 2.0 20.0 95 3/4 3/4 3/4 Max 3/4 3/4 0.55 3/4 500 3/4 60 C/W mA pF V Unit 135 16 Rth (j-) Marking Following Indicates the Data of Manufacture Type code Lot No. Month of manufacture Year of manufacture January to December are denoted by letter A to L respectively. Last decimal digit of the year of manufacture 0 1 2 3 4 SA 5 6 7 8 9 Cathode mark Standard Soldering Pad Unit: mm 1.4 3.0 1.4 Handling Precaution Schottky barrier diodes are having large-reverse-current-leakage characteristic compare to the other rectifier products. This current leakage and improper operating temperature or voltage may cause thermal runaway. Please take forward and reverse loss into consideration when you design. 2.1 2 2003-02-17 CMS11 iF - vF 100 1.6 PF (AV) - IF (AV) DC 1.4 1.2 a = 120 1.0 0.8 0.6 0.4 0.2 0.0 0.0 0 a 360 a = 60 Rectangular waveform a = 180 (A) Instantaneous forward current 10 Tj = 150C 125C 75C 1 25C Average forward power dissipation PF (AV) (W) iF Conduction angle: a 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 0.1 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Instantaneous forward voltage vF (V) Average forward current IF (AV) (A) Ta max - IF (AV) Device mounted on a ceramic board (board size: 50 mm 50 mm) 160 Rectangular waveform 160 T max - IF (AV) Maximum allowable lead temperature T max (C) 140 120 100 80 60 40 a = 120 a = 60 Rectangular waveform a = 180 Maximum allowable ambient temperature T max (C) 140 120 100 80 60 40 20 0 0 a = 60 DC 0 a 360 IF(AV) Conduction angle: a VR = 20 V a = 120 DC a = 180 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 360 IF(AV) 20 Conduction angle: a VR = 20 V 0 0 0.4 0.8 1.2 0 a 1.6 2.0 2.4 2.8 3.2 Average forward current IF (AV) (A) Average forward current IF (AV) (A) rth (j-a) - t (C/W) 1000 Device mounted on a glass-epoxy board Soldering land: 2.1 mm 1.4 mm 100 Transient thermal impedance rth (j-a) 10 Device mounted on a glass-epoxy board Soldering land: 6.0 mm 6.0 mm Device mounted on a ceramic board Soldering land: 2.0 mm 2.0 mm 1 0.001 0.01 0.1 1 10 100 1000 Time t (s) 3 2003-02-17 CMS11 Surge forward current (non-repetitive) 50 1000 Ta = 25C 40 I R - Tj (typ.) f = 1 MHz (A) Peak surge forward current IFSM Junction capacitance 30 Cj (pF) f = 50 Hz Ta = 25C 20 100 10 0 1 10 100 10 1 10 100 Number of cycles Reverse voltage VR (V) I R - Tj 100 (typ.) 1.6 Rectangular waveform 0 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 VR a 360 PR (AV) - VR 1.4 (typ.) (mA) Pulse test 10 Repetitive peak reverse current IR VR = 40 V Average reverse power dissipation PR (AV) (W) DC 1 300 240 180 120 Conduction angle: a Tj = 150C 0.1 VR = 30 V VR = 20 V 0.01 VR = 10 V VR = 5 V 0.001 a = 60 10 20 30 40 0 20 40 60 80 100 120 140 160 Junction temperature Tj (C) Reverse voltage VR (V) 4 2003-02-17 CMS11 RESTRICTIONS ON PRODUCT USE 000707EAA * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. * The information contained herein is subject to change without notice. 5 2003-02-17 |
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